Method of manufacturing printed wiring board
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United States of America Patent
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-
Apr 19, 1994
Grant Date -
N/A
app pub date -
Jan 6, 1992
filing date -
Jul 24, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
According to the present invention, inequality in the film thickness of the solder resist and the occurrence of the blur can be eliminated, and it is possible to perform a screen printing for the solder resist with a minute pattern which leads to the formation of a minute solder land. A solder resist 60 is screen printed while leaving an etching resist 3 in the step for forming a printed wiring circuit 5 on the front of an insulating board 4. Afterward, the etching resist and the overlaid solder resist 60a are simultaneously removed, thereby forming a flat surface over the printed wiring circuit 5.
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