Low friction polyamide, polyethylene, P.T.F.E. resin

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United States of America Patent

PATENT NO 5304422
SERIAL NO

07585001

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Abstract

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A polyamide resin composition comprising: (a) 100 parts by weight of a polyamide; (b) from about 1 part to about 80 parts by weight of an aromatic polyamide fiber; (c) from about 3 parts to about 80 parts by weight of a polytetrafluoroethylene; and (d) from about 1 part to about 20 parts by weight of high-density polyethylene is disclosed. The polyamide resin composition can be molded into sliding members, like bearings, bushings and slide rails, that demonstrate excellent mechanical and physical properties, like low frictional force, low self-abrasion, and low abrasion to metals.

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Patent Owner(s)

Patent OwnerAddress
BANDO CHEMICAL INDUSTRIES LTD A CORP OF JAPAN2-15 MEIWADORI 3-CHOME HYOGO-KU KOBE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishigaki, Takatoshi Tokyo, JP 2 25
Kimura, Shinichi Tokyo, JP 79 823
Tanabe, Takayoshi Tokyo, JP 51 663
Tsuchikawa, Shuji Tokyo, JP 1 16

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