Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame
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United States of America Patent
Stats
-
Apr 19, 1994
Issued Date -
N/A
app pub date -
May 13, 1993
filing date -
Jul 16, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for manufacturing a carrier element is described that has one or more ICs to be incorporated into an identity card or credit card. The carrier element comprises a substrate having on its surface a plurality of contact areas which are connected via connector paths to corresponding terminals of the IC disposed on the substrate. The IC, including the connections to the conductor paths, is protected from mechanical stresses by a cured casting compound. In order to prevent the casting compound from flowing off uncontrollably during its application, an opening is provided in the heat-set adhesive layer applied to one side of the substrate, said opening holding back the liquid resin during its application and acting as a limiting frame. The opening in the adhesive layer is located at least where the IC is to be disposed.
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