Film-type power resistor combination with anchored exposed substrate/heatsink

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5304977
SERIAL NO

07863851

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The film-type electrical power resistor includes a flat ceramic chip on the upper surface of which is screen-printed a resistive film. Terminals (leads) are mechanically and electrically connected to the upper chip surface, the terminals being such that the chip may be positioned by the terminals in a predetermined position in a mold cavity during manufacture of the resistor--prior to introduction of synthetic resin. The synthetic resin forms a molded electrically insulating body that embeds the portions of the terminals that are relatively near the chip, and also embeds the upper portion of the chip, but does not embed the bottom surface of the chip. The relationships are such that the lower chip surface may be engaged flatwise with a flat region of a chassis or heatsink. Accordingly, the chip is a substrate for the film, a heatsink for the film, an insulator maintaining the film electrically insulated from the chassis, and a spacer maintaining the terminals spaced from the chassis. The resistor does not contain any metal layer that is either in an electric circuit or projects outwardly relative to the edges of the chip. To permit assembly of the resistor with a chassis or heatsink, a bolthole extends through the body at a region outside the chip.

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Patent Owner(s)

Patent OwnerAddress
CADDOCK ELECTRONICS INC A CORPORATION OF CA1717 CHICAGO AVENUE RIVERSIDE CA 92507

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Caddock, Jr Richard E Winchester, OR 12 92

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