Power carrier with selective thermal performance
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United States of America Patent
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-
Apr 19, 1994
Grant Date -
N/A
app pub date -
Jan 27, 1993
filing date -
Jan 27, 1993
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A microelectronic package comprising a circuit carrier having a power chip, an integrated circuit means, and thermal conduction means for carrying heat from the microelectronic package is provided. The thermal conduction means includes a first heat dissipation back plate means associated with the power chip and a second heat dissipation back plate means associated with the integrated circuit means. The heat dissipation back plate means are electrically isolated from each other and have different heat dissipation capacity.
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