Method and apparatus for coating substrates
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United States of America Patent
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Apr 26, 1994
Grant Date -
N/A
app pub date -
Jul 29, 1992
filing date -
Jun 27, 1989
priority date (Note) -
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Abstract
A method and an apparatus for coating substrates is described in which the layer to be applied is produced by the condensing particles of a plasma generated by a gas discharge which are incident on the substrates. Both an arc discharge vaporization coating process and a cathode sputtering coating process are effected in the same apparatus, and the arc discharge vaporization process is carried out before the cathode sputtering process.
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