Chiplid, multichip semiconductor package design concept
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United States of America Patent
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Apr 26, 1994
Grant Date -
N/A
app pub date -
Dec 2, 1992
filing date -
Dec 2, 1992
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic package assembly which has a first electrical device mounted to a housing and a second electrical device attached to the lid of the package. The first and second devices are completely encapsulated by the lid and housing, and are typically coupled to a printed circuit board by pads on the bottom surface of the package. The electrical devices may be active or passive elements that are coupled together by conductive pads located on the top and bottom surfaces of the housing and lid, respectively. The conductive pads are typically soldered together when the lid is attached to the housing.
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