Method for manufacturing a printed wiring board having a shield layer
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United States of America Patent
Stats
-
May 3, 1994
Grant Date -
N/A
app pub date -
Aug 2, 1991
filing date -
Aug 13, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The method for manufacturing the printed wiring board having a shield layer of the present invention is characterized in that, in a method for manufacturing a printed wiring board wherein a printed wiring circuit is provided on one or both sides of an insulating board and a shield layer is provided on the printed wiring circuit through an insulating layer, a shield layer and an earth circuit are formed on the insulating layer while injecting under pressure a coating for shield from a filling nozzle through a mask.
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Cited Art Landscape
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