Leads for semiconductor chip assembly and method
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United States of America Patent
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May 3, 1994
Grant Date -
N/A
app pub date -
Nov 24, 1992
filing date -
Nov 24, 1992
priority date (Note) -
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Abstract
A semiconductor device is formed without using a leadframe. A semiconductor device is formed in one area of a semiconductor chip and a second area includes conductors to which lead wires are bonded. The lead wires are used for mounting the semiconductor device.
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