Device for forming solder connections
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United States of America Patent
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-
May 3, 1994
Grant Date -
N/A
app pub date -
Sep 18, 1992
filing date -
Jan 30, 1990
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A device for forming a solder connection between a plurality of electrical conductors, comprises a hollow, dimensionally heat-recoverable sleeve 1 formed for example from polyvinylidine fluoride, the sleeve having one end that is open to allow the insertion of the electrical conductors therein, and another end that is closed by a substantially spherical sealing insert.
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