Method for processing semi-conductor wafers in a multiple vacuum and non-vacuum chamber apparatus

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United States of America Patent

PATENT NO 5310410
SERIAL NO

07807162

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Abstract

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A method wherein wafers are transferred between a loading chamber and a central vacuum chamber. A plurality of first vacuum processing chambers are disposed in a satellite relationship around the central chamber. A plurality of second non-vacuum chambers are interspersed with the first chambers in a satellite relationship around the central chamber. A second central vacuum chamber communicates with one of the first chambers through a valve. Third and fourth pluralities of chambers are disposed in a satellite relationship around the second central chamber to respectively perform functions similar to those performed by the first and second chambers, the fourth chambers being interspersed with the third chambers.

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Patent OwnerAddress
SPUTTERED FILMS INCCALIFORNIA USA CALIFORNIA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Begin, Robert G Montecito, CA 1 375
Clarke, Peter J Santa Barbara, CA 26 546

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