Process for bonding a molded article of a thermoplastic saturated norbornene resin
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United States of America Patent
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May 10, 1994
Grant Date -
N/A
app pub date -
Dec 14, 1992
filing date -
Dec 18, 1991
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention relates to a process for bonding a molded article of a thermoplastic saturated norbornene resin in which when the molded article is bonded to an adherend widely different from the molded article in coefficient of linear expansion, the adhesion surface of the molded article and that of the adherend are stuck together with an adhesive composed mainly of an epoxy resin which has an elasticity (Shore hardness D: about 40 or less) imparted by modification with a polymer having reactive silyl groups, and then the adhesive is cured. Thus, there is provided such an excellent bonding process that the adhesive strength is hardly deteriorated by a temperature change.
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