Importance

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Abstract

Dry, laser-based, lithographic techniques and systems for patterning a surface of a wafer or other substrate are disclosed. The techniques and systems are particularly adapted for automated micro-fabrication of integrated circuits on semiconductor wafers. The invention entails dry depositing a resist material on a surface of a substrate, then generating a pattern in the resist material by selectively exposing the resist material to pulsed UV laser radiation, controlling the ambient exposure of the resist material between the resist-depositing and pattern-generating steps, and, finally, transferring the pattern from the resist to the substrate or otherwise employing the pattern to transform the substrate by deposition or implantation of materials.

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First Claim