Backplane grounding for flip-chip integrated circuit
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United States of America Patent
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May 10, 1994
Grant Date -
N/A
app pub date -
Jan 24, 1992
filing date -
Jan 24, 1992
priority date (Note) -
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Abstract
A semiconductor device package comprises a substrate (20) having a metallization pattern (22) on at least one surface, and a semiconductor device (10) having an active surface (12) and a grounded surface (14) on opposed sides. The semiconductor device is electrically attached to the substrate metallization pattern with the active surface (12) facing the substrate. A polymeric underfill material (30) substantially fills the space between the semiconductor device and the substrate. An electrically conductive material (35) covers the exposed grounded surface (14) of the semiconductor device and at least a portion of the metallization pattern (22), providing electrical connection between the grounded surface of the semiconductor and the metallization pattern (22) on the substrate.
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