Integrated circuit device having a polyimide moisture barrier coating
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United States of America Patent
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-
May 17, 1994
Grant Date -
N/A
app pub date -
Dec 22, 1989
filing date -
Dec 22, 1989
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor package device is disclosed. In one embodiment, attached by its active face to a lead-on-chip leadframe having leadfingers is an integrated circuit. The integrated circuit has a polyimide coating on its backside. An encapsulating material surrounds the integrated circuit and the lead-on-chip leadframe so that the leadfingers are exposed. The polyimide coating on the backside of the integrated circuit helps to reduce package cracking arising from mounting the device to a printed circuit board by relflow solder.
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