Reduced pressure processing system and reduced pressure processing method
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United States of America Patent
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May 24, 1994
Grant Date -
N/A
app pub date -
May 28, 1992
filing date -
May 28, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A reduced pressure processing system includes a load lock chamber having an opening communicating with a process atmosphere in which a wafer is processed and/or the outer air atmosphere, a gate valve which is arranged at the opening to close/open the chamber with respect to the process atmosphere and/or the outer air atmosphere, a robot for loading/unloading the wafer into/from the chamber, an evacuation pump for evacuating the chamber, a heater for heating the wall of the chamber, and a controller for controlling the gate valve, the robot, the evacuation pump, and the heater.
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