Leadless ceramic package with improved solderabilty
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United States of America Patent
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May 24, 1994
Grant Date -
N/A
app pub date -
Feb 16, 1993
filing date -
Feb 16, 1993
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of fabricating a leadless ceramic package having improved solderability characteristics. The ceramic packages are singulated from the package array before electroplating. This eliminates the damage which may occur to the plating layer during singulation, and permits plating of base metal exposed by singulation. Furthermore, the plating solution is not required to penetrate small-diameter castellation holes, which would often result in incomplete electroplating of the castellation surfaces.
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