Heat resistant resin composition comprising polymers of N-(substituted) maleimides and improved process for the preparation of said maleimides

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United States of America Patent

PATENT NO 5314950
SERIAL NO

08007225

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Abstract

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Novel resin compositions are provided which possess excellent heat resistance and thermal color stability, alone, or in admixture with bulk resins. The claimed resin compositions comprise homo- and/or copolymers of N-(2,3-dimethylphenyl) maleimide, alone, or in further combination with resins composed of copolymer components, such as vinyl copolymers and rubber-grafted vinyl copolymer resins. The resin compositions have improved heat resistance and produce molded articles with desirably light colors. Also provided is an improved process to make maleimide monomers by using selected polar solvents whereby the amount of uncyclizable trans-amic acid is held at tolerable levels and the desired maleimide is obtained in high yields, free from by-products.

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Patent Owner(s)

Patent OwnerAddress
CYTEC TECHNOLOGY CORP300 DELAWARE AVENUE WILMINGTON DE 19801

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Singh, Balwant Stamford, CT 52 529
Tynik, Robert J Stamford, CT 4 62

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