Importance

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Abstract

Low temperature, co-fired ceramic (LTCC) modules (10, 80, 82, 110, 102, 140, 160) are interconnected to one another, stacked and automatically connected to other modules by rigid LTCC interconnecting modules (104), or provided with covers or hermetically sealed covers (130, 166) that automatically register and make electrical or mechanical connections between the cover and the protected module. The various types of connections are achieved by forming in the LTCC modules, during the lamination process, patterns of frictionally interfitting bumps (60, 62, 66, 84a, 84b, 84c) on one side and depressions (70, 72, 76, 81a, 81b, 81c) on the other, whereby a pattern of bumps on one side of one module will connect both mechanically and electrically to a mating pattern of depressions on the other module to stack and automatically lock vertical packages of LTCC modules. The concept is applicable to an LTCC test board (120) at which a module (124) to be tested may be registered and connected to a test board and then tested and readily removed without time consuming registration and connection, and allowing reuse of the test board.

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First Claim