Method for bonding lead with electrode of electronic device
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United States of America Patent
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-
May 31, 1994
Grant Date -
N/A
app pub date -
Nov 9, 1992
filing date -
Nov 8, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for bonding leads of a film carrier to electrodes of electronic devices includes a step for positioning the leads and the electrodes with a predetermined clearance aligned to define corresponding pairs of the leads and electrodes, and a step for placing a bonding tool having a conductive bonding material served such that the conductive bonding material is located between the lead and electrode of one of the corresponding pairs. The method further includes a step for pressing the lead of one corresponding pair such that the conductive bonding material is pressed between the lead and the electrode, thereby bonding the lead and electrode. After bonding, the conductive bonding material is pulled to cut and leave the bonded conductive bonding material. Then, while the bonding tool is released from the bonded pair, the conductive bonding material is served to the bonding tool for the next bonding operation.
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