Copper paste for internal conductor of multilayer ceramic electronic component
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United States of America Patent
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May 31, 1994
Grant Date -
N/A
app pub date -
Jan 11, 1993
filing date -
Jan 9, 1992
priority date (Note) -
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Importance
Abstract
Copper paste containing copper powder having a mean particle size of 0.5 to 2 .mu.m and a particle size range of 0.3 to 4 .mu.m an organic vehicle and a solvent, the paste including 40 to 60 percent by weight copper powder is applied onto ceramic green sheets in a thickness of 1 to 3 .mu.m, for forming internal conductors of a multilayer ceramic electronic component, such as a multilayer ceramic capacitor. The ceramic green sheets provided with such copper paste films are stacked and fired so that occurrence of voids in the laminate and deformation of the laminate are suppressed in the resulting multilayer ceramic electronic component.
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