Method for forming electrical interconnections in laminated vias
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United States of America Patent
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May 31, 1994
Grant Date -
N/A
app pub date -
Dec 10, 1992
filing date -
Dec 10, 1992
priority date (Note) -
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Abstract
A method for forming electrical interconnections in vias is provided by laser drilling vias in a composite that contains at least two circuitized organic polymeric substrates superimposed upon each other. The laser drilling causes metallic circuit lines contained within each substrate to melt and form a fused mass protruding a short distance out of the side of the drilled vias. Next, the drilled vias are plated with a conductive metal to thereby provide the interconnections.
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