Method of soldering an integrated circuit
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jun 7, 1994
Issued Date -
N/A
app pub date -
Oct 16, 1992
filing date -
May 30, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated circuit device support tool which includes a device for providing a vacuum for holding an integrated circuit device to be soldered to a printed circuit board. The tool also includes a plurality of thin, pressure transferring members for pressing the leads of the integrated circuit device against a printed circuit board during soldering. The pressure transferring members are of a thin material so as not to provide a heat sink during the soldering operation.
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