Method for packaging an integrated circuit using a reconstructed plastic package
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United States of America Patent
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Jun 7, 1994
Grant Date -
N/A
app pub date -
Feb 1, 1993
filing date -
Feb 1, 1993
priority date (Note) -
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status (Latency Note)
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Abstract
A method of re-configuring any pre-fabricated plastic package (with or without a silicon chip and wires inside) so that an integrated circuit chip can be installed and interconnected for normal use. A pre-molded plastic package is abraded over (or molded to expose) the die attach pad and the wire bond pads. Advantageously, the encapsulating material is removed without damaging the plating material on the lead frame. A new chip is then mounted onto the chip mounting pad and new wire bonds are connected between the new chip and the lead frame. Encapsulating material, such as epoxy, is then placed over the chip and wire bonds and cured.
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