Importance

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Abstract

A connector for a leadless IC package having contacts to be pressure contacted with conductive pads arranged on a lower surface of a leadless IC, wherein each of the contacts is formed of a spring element, the connector including a contact holding portion in which the spring element is implanted, a contact braking portion disposed above the contact holding portion, and a contact operating portion laterally movably disposed between the contact braking portion and the contact holding portion, the spring element extending through a contact operating through-hole formed in the operating portion, a distal end of the spring element being received in a contact braking through-hole formed in the braking portion, the spring element being sidewardly pressurized by an inner wall of the contact operating through-hole when the operating portion is moved in one direction, so that the spring element is bent and displaced, the spring element being restored to its original state when the operating portion is laterally moved in the other direction, the distal end portion of the spring element being extended and retracted while it is braked by the inner wall of the contact braking through-hole by the bending displacement and restoration, the distal end portion of the spring element being pressure contacted the conductive pad of the IC when the spring element is expanded.

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First Claim