Method of fabricating a thin-film transistor and wiring matrix device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 14, 1994
Issued Date -
N/A
app pub date -
Jan 8, 1993
filing date -
Jul 11, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for easily fabricating a thin-film transistor device which has a high reliability. A thin-film transistor is formed on a substrate, the transistor including a first conducting layer deposited on the substrate, a gate insulating layer formed on the first conducting layer, a semiconductor layer deposited on the gate insulating layer, and source and drain electrodes on the semiconductor layer. A multi-layer wiring section is provided adjacent the thin-film transistor, including a first conducting wiring layer formed on the substrate, wiring insulating layer formed on the first conducting wiring layer, and a second conducting wiring layer deposited on the wiring insulating layer and contacting the first conducting wiring layer as well as a portion of the thin-film transistor. The gate insulating layer and the wiring insulating layer are made of the same inorganic material and are of the same thickness.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully