Multi-chip module testing

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United States of America Patent

PATENT NO 5321277
SERIAL NO

08112907

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Abstract

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A base for a multi-chip module that provides for built-in testability. Active test components are embedded in a module substrate. These test components primarily consist of boundary scan cells that comply with the IEEE 1149.1 test standard. The scan cells are connected to each other, and are connected to interconnection paths among chips and to individual chips, thereby partitioning the module into testable partitions. These partitions permit testing of chip interconnections, chip functionality, and module functionality. Scan cell connections may be mask programmable so that the same multi-chip module base can be used for many different multi-chip module configurations.

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Patent Owner(s)

Patent OwnerAddress
TEXAS INSTRUMENTS INCORPORATED12500 TI BOULEVARD M/S 3999 DALLAS 75243

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Edwards, Darvin R Dallas, TX 26 1053
Heinen, Katherine G Dallas, TX 18 624
Sparks, Steve E Plano, TX 1 50

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