Probe apparatus and method of alignment for the same
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United States of America Patent
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-
Jun 14, 1994
Grant Date -
N/A
app pub date -
Jul 31, 1992
filing date -
Aug 1, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A probe apparatus for measuring electrical characteristics of chips arranged on a wafer comprises a probe card having probe needles and a rotary chuck for supporting the wafer. The chuck is supported on an XY stage. A stationary alignment bridge is provided with a stationary camera and a capacitance sensor. The stage is provided with a movable camera. A transparent plate on which a target is formed is attached to the chuck. The target and its peripheral portion are formed of transparent thin films. The target is used for positioning and focusing of the cameras. The thin films are used for height detection by use of the capacitance sensor.
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