Method for manufacturing polyimide multilayer wiring substrate
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United States of America Patent
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Jun 21, 1994
Grant Date -
N/A
app pub date -
Nov 20, 1992
filing date -
Nov 21, 1991
priority date (Note) -
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Abstract
A layered structure comprising wiring layers and polyimide layers is formed on a ceramics board and a layered structure comprising wiring layers and polyimide layers is formed on an aluminum board. Both the structures are bonded together through adhesives to bring metal bumps formed on the former structure into electric contact with metal bumps formed on the surface of the latter structure and thereafter the aluminum board is removed.
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