Process for forming polyimide-metal laminates
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United States of America Patent
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Jun 21, 1994
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N/A
app pub date -
Nov 18, 1991
filing date -
Feb 24, 1987
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Abstract
Polyetherimide-metal laminates are formed by etching the surfaces of a polyetherimide web with a glycol-containing etchant followed by electroless nickel or cobalt deposition and then by copper deposition. The glycol-containing etchant can be utilized to form through holes through the web.
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