Semiconductor wafer level package
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United States of America Patent
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Jun 21, 1994
Grant Date -
N/A
app pub date -
Dec 16, 1991
filing date -
Dec 16, 1991
priority date (Note) -
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Abstract
A semiconductor wafer level package used to encapsulate a device fabricated on a semiconductor substrate wafer before dicing of the wafer into individual chips. A cap wafer is bonded to the semiconductor substrate wafer using a pre-patterned frit glass as a bonding agent such that the device is hermetically sealed inside a cavity. A hole in the cap wafer allows electrical connections to be made to the device through electrodes which pass through the frit glass seal.
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