Method of producing coaxial connections for an electronic component, and component package
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United States of America Patent
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-
Jun 28, 1994
Grant Date -
N/A
app pub date -
Nov 10, 1992
filing date -
Mar 26, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An object of the invention is the production of coaxial connections for the input/output links of the component and/or of the housing which encapsulates it. More precisely, the component placed in a package (B), is conventionally connected by wires to its package; the wires are next covered by a first insulating layer (21) then by a second conducting layer (24) in such a way that this second layer is linked to the earth pads (P.sub.E1) of the package. The layers (21, 24) thus form collectively-produced coaxial structures with the connection wires (F). A similar process is used for the input/output connections (P) of the package itself.
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