Undercut membrane mask for high energy photon patterning
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United States of America Patent
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Jul 5, 1994
Grant Date -
N/A
app pub date -
Nov 14, 1991
filing date -
Nov 14, 1991
priority date (Note) -
Expired
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Abstract
A mask for use with high energy radiation sources in precision projection processing by excimer lasers, for example, is described. The mask comprises a suitable substrate, such as silicon, upon which a multilayer dielectric stack is formed which acts as a reflective coating for the impinging excimer laser radiation, minimizing energy absorption by the mask substrate. The mask transparent areas are defined by the through-holes in the mask. The through-holes are formed with a conically undercut edge profile to define a thin object plane for the mask and minimize scattering of the radiation from the through-hole sidewalls. A method for fabricating the mask is also described.
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