Barbituric acid-modified bismaleimide with diamine and polyisocyanate-modified epoxy resin
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United States of America Patent
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Jul 5, 1994
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N/A
app pub date -
Jul 10, 1992
filing date -
May 8, 1990
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Abstract
A process for manufacturing a high glass transition temperature printed circuit board comprising blending a modified bismaleimide resin into a modified epoxy resin is disclosed. Particularly the material is manufactured by blending a bismaleimide resin reacted with barbituric acid and its derivative thereof and an epoxy resin with an oxazolidone ring resulting from the reaction of a polyisocyanate and an epoxy resin modified with a secondary diamine and followed by curing. The resultant product has a high glass transition temperature, a good adhesion, flame retardancy, and a low bromine content.
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