IC card having adhesion-preventing sheets
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 5, 1994
Grant Date -
N/A
app pub date -
Jul 17, 1990
filing date -
Sep 9, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An IC card includes a substrate, semiconductor devices mounted on at least one of the major surfaces of the substrate and a casing in which the substrate with the semiconductor devices mounted on it is housed. The casing includes a frame and panels bonded to the frame on the opposite sides of the frame by means of adhesive layers. The semiconductor devices are prevented from being bonded to the panel via the adhesive layers at locations on the adhesive layers facing the semiconductor devices.
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