Bridge for connecting cores in a manufacturing equipment of polycrystal silicon

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5327454
SERIAL NO

07849450

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

In a equipment for manufacturing polycrystal silicon by depositing it on filament cores electrically heated, by means of thermal decomposition of monosilane gas, a bridge for connecting said filament cores is constituted by tantalum, molybdenum, tungsten or zirconium. Preferably the sectional shape of the connection bridge may be of upturned triangle, tear droplet or rectangle.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
KOMATSU ELECTRONICS METLAS CO LTD A CORP OF JAPAN2612 SHINOMIYA HIRATSUKA-SHI KANAGAWA-KEN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Miyamoto, Yusuke Hiratsuka, JP 69 672
Nagai, Kenichi Tokyo, JP 37 303
Ohtsuki, Minoru Hiratsuka, JP 1 9

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation