Thermally and electrically conductive adhesive material and method of bonding with same
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United States of America Patent
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Jul 12, 1994
Grant Date -
N/A
app pub date -
Mar 29, 1993
filing date -
Mar 29, 1993
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention discloses a thermally and electrically conductive adhesive material comprising a hardened adhesive, and a non-solidified filler containing a liquid metal dispersed in separate spaced regions of the adhesive. The hardened adhesive provides a mechanical bond whereas the filler provides continuous thermal and electrical metal bridges, each bridge extending through the adhesive and contacting the bonded surfaces. The method includes (a) dispersing a filler containing a liquid metal into an unhardened adhesive, (b) contacting the unhardened adhesive and the filler in non-solidified state to the surfaces resulting in separate spaced regions of the non-solidified filler contacting both surfaces, and (c) hardening the adhesive.
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