Linear planar-magnetron sputtering apparatus with reciprocating magnet-array
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United States of America Patent
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Jul 12, 1994
Grant Date -
N/A
app pub date -
Dec 11, 1992
filing date -
Dec 11, 1992
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A linear planar-magnetron sputtering cathode comprises a cathode body (22) including two side-walls (104) two end-walls (106) and a target-supporting member (102) attached to the walls. The cathode body encloses a magnet array (40) which may be moved reciprocally in at least one direction relative to the cathode body. A cooling fluid may be flowed through the target supporting member for cooling the target. A cooling fluid may also be flowed through the side-walls and the end-walls for cooling the end walls. A cooled enclosure is thus be provided for the magnet-array.
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