Functional fluid additives for acid copper electroplating baths
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United States of America Patent
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Jul 12, 1994
Grant Date -
N/A
app pub date -
Dec 23, 1992
filing date -
Dec 23, 1992
priority date (Note) -
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Abstract
A process and composition for high acid/low metal copper electroplating baths with improved leveling, adhesion, ductility and throwing power. The bath includes effective amounts of a functional fluid having at least one ether group derived from an alcohol epoxy or a bisphenol A and containing ethoxy and propoxy functionalities.
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