Importance

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Abstract

An improved integrated circuit package including a heat sink and an improved method for making the package is disclosed. The package incorporates an improved sealing (or locking) ring located circumferentially around the heat sink to provide a better seal between the encapsulant and heat sink and to reduce the possibility that contaminants from outside the package will reach the interior semiconductor die. A stress relief section is formed in the package leads and a dielectric adhesive material is used to attach the package leads to a heat sink surface. The dielectric adhesive creates a secure bond between leads and heat sink, allows heat transfer from the leads to the heat sink, and prevents shorting of the leads to the heat sink. An improved method for making the package involves creating a dimensional mismatch between the thickness of the heat sink and a corresponding dimension of the mold cavity so as to provide a tighter seal between a heat sink surface that will be exposed to the exterior of the finished package and the mold cavity during the encapsulation process to prevent encapsulant from forming on the exposed heat sink surface. Stresses in the leadframe created during encapsulation are mitigated by the stress relief section in the leads.

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First Claim