High density interconnect structure including a chamber
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 19, 1994
Issued Date -
N/A
app pub date -
Oct 25, 1993
filing date -
Apr 5, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A high density interconnect structure is rendered suitable for the packaging of overlay sensitive chips by providing a cavity in the high density interconnect structure which spaces the sensitive surface of such chips from the overlying high density interconnect structure in a manner which prevents undesired interactions between the dielectric of the high density interconnect structure and the chip.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully