Concave soldering iron tip and method of soldering using same
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United States of America Patent
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Jul 26, 1994
Issued Date -
N/A
app pub date -
Mar 17, 1993
filing date -
Mar 17, 1993
priority date (Note) -
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Abstract
In accordance with a preferred embodiment of the present invention, a concavity of an elliptical shape is formed in a chisel-shaped soldering tip to create a reservoir in which a quantity of molten solder is retained by surface tension. In a preferred method of use, the leads of an electronic component and the lands of a circuit board to which they are to be electrically connected are pretreated with flux. The tip, with a blob of solder in its concavity, is drawn along the lead/land region with the blob of molten solder making contact therewith, so that molten solder is wicked into the region, and joints are formed between the leads the lands.
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