High density connector for stacked circuit boards
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United States of America Patent
Stats
-
Aug 2, 1994
Grant Date -
N/A
app pub date -
May 11, 1993
filing date -
May 11, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Disclosed is a device for electrically coupling stocked circuit boards using conductive polymer interconnect material and a spacer element. In one embodiment, coaxial connection is provided by means of an array of wires within undulating metal envelopes. In another embodiment, pins are provided within holes in a plastic spacer. In a third embodiment, wires are laid on a substrate and successive laminations are built up to form the spacer element. In a fourth embodiment, wire arrays are extrusion molded within thermoplastic sheets which are laminated to form the spacer element.
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