Cleaning compositions for removing etching residue and method of using
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United States of America Patent
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Aug 2, 1994
Issued Date -
N/A
app pub date -
Jul 9, 1992
filing date -
Nov 5, 1990
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A stripping and cleaning composition for removing resists and etching residue from substrates containing hydroxylamine and at least one alkanolamine is described. Further, a cleaning composition for removing etching residue from semiconductor substrates containing hydroxylamine, at least one alkanolamine, at least one chelating agent, and water is described. The preferred chelating agent is 1,2-dihydroxybenzene or a derivative thereof. The chelating agent provides added stability and effectiveness to the cleaning composition.
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