Weatherable styrenic film structures with intermediate tie layer and laminates thereof

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United States of America Patent

PATENT NO 5334450
SERIAL NO

07886659

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Abstract

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A weatherable film for lamination to a non-weatherable substrate, including, for example a three-layer film structure including: at least one first surface layer of a weatherable polymer comprising (a) AES, ASA, SAN or mixtures thereof or (b) any of the polymers of (a) blended with PVC, CPE, aliphatic polyurethanes or saturated styrenic block copolymers; said layer having a 1 percent secant modulus of greater than about 150,000 psi; at least one second intermediate layer being a tie layer underlying the weatherable layer, said intermediate tie layer being adjacent to and adhered to the weatherable layer, said intermediate tie layer having a modulus of less than about 150,000 psi; said tie layer adherable to at least a third underlying layer; and at least one third layer underlying the tie layer, said third layer adjacent to and adhered to the tie layer said third layer having a modulus of less than about 150,000 psi.

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Patent Owner(s)

  • RENSSELAER POLYTECHNIC INSTITUTE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kelch, Robert H Granville, OH 17 568
Zabrocki, Vincent S Newark, OH 8 221

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