Anisotropically electroconductive adhesive composition
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United States of America Patent
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Aug 9, 1994
Grant Date -
N/A
app pub date -
Feb 22, 1993
filing date -
Feb 22, 1993
priority date (Note) -
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Abstract
An improvement is proposed in an anisotropically electroconductive adhesive composition comprising an insulating adhesive resin as a matrix and electroconductive carbon particles dispersed in the matrix used for electrically connecting oppositely facing electrode terminals on various kinds of electronic devices and circuit boards. Different from conventional spherical carbon particles, the conductive particles used here are carbon particles each having a plurality of projections on the surface as formed, for example, by the high-temperature calcination of spherical carbon particles blended with a tar or pitch. By virtue of the projections on the carbon particles, the electric connection formed by using the inventive adhesive composition is very reliable and durable even under adverse ambient conditions involving a high temperature, high humidity, vibrations and mechanical shocks by virtue of the anchoring effect by the projections.
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