Process for hydrosonically area embossing thin thermoplastic film materials
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United States of America Patent
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Aug 9, 1994
Grant Date -
N/A
app pub date -
Sep 23, 1992
filing date -
Sep 23, 1992
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The method includes the steps of (1) placing the thin thermoplastic film material on a pattern anvil having a pattern of raised areas wherein the height of the raised areas is generally less than the thickness of the film material; (2) conveying the thermoplastic film material, while placed on the pattern anvil, through an area where a liquid is applied to the film material; and (3) subjecting the thermoplastic film material to a sufficient amount of ultrasonic vibrations in the area where the liquid is applied to the film material to emboss the film material in a pattern generally the same as the pattern of raised areas on the pattern anvil.
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