Job configuration for semiconductor manufacturing
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United States of America Patent
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Aug 23, 1994
Grant Date -
N/A
app pub date -
Apr 23, 1992
filing date -
Apr 23, 1992
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus and method for configuring semiconductor jobs to achieve a desired level of set serviceability, in either probability or expectation, using a minimal number of wafers. The configuration problem is formulated as a mathematical optimization, where the serviceability level and yield losses, at chip, wafer and job levels, are explicitly considered. The problem is then reformulated by replacing the mathematically intractable service level constraints with tractable lower bounds. The reformulated mathematical optimization is efficiently solved using marginal allocation, giving good, feasible solutions to the original configuration program.
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