Palladium-nickel alloy plating solution
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United States of America Patent
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Aug 30, 1994
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N/A
app pub date -
Mar 11, 1993
filing date -
Mar 30, 1992
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Abstract
A novel palladium-nickel alloy plating solution provides a uniform electrodeposited film with excellent gloss at a high electric current density. A palladium-nickel alloy plating solution comprises a water-soluble palladium salt, a water-soluble nickel salt, ammonia, an ammonium salt, and 3-pyridinesulfonic acid, which are solved in water. Further additives may be added in the solution.
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