US Patent No: 5,342,807
Number of patents in Portfolio can not be more than 2000
Soft bond for semiconductor dies
Stats
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Aug 30, 1994
Issued date -
Nov 13, 1992
filing date -
07/976,093
serial no -
In Force
status
Importance
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Abstract
On a semiconductor integrated circuit die, a semipermanent electrical connection is effected by the use of wirebond techniques, in which the parameters of the wirebond are controlled, so that less bonding force retains the leadwires to the bondpads than the attachment strength of the bondpads to the die. The wirebond techniques include attaching leadwires to bondpads on the die, using ultrasonic wedge bonding. The strength of the bond between the leadwires is significantly less than the attachment strength of the bondpads, preferably by a ratio which ensures that the bondpads are not lifted from the die when the leadwires are removed by breaking the bond between the leadwires and the bondpads. Subsequent to testing and burnin, the bond between the leadwires and the bondpads is severed. The die are then removed from the package body and the bondpads may then be attached by conventional means. The technique is useful in providing known good die.
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First Claim
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International Classification(s)
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- [Patents Count]
Cited Art
| Patent Info | (Count) | # Cites | Year |
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| 4,855,672 Method and process for testing the reliability of integrated circuit (IC) chips and novel IC circuitry for accomplishing same | 26 | 1987 | |
| 4,842,662 Process for bonding integrated circuit components | 62 | 1988 | |
| 5,086,269 Burn-in process and apparatus | 36 | 1991 | |
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| 4,760,335 Large scale integrated circuit test system | 33 | 1985 | |
| 4,899,107 Discrete die burn-in for nonpackaged die | 195 | 1988 | |
| 5,109,320 System for connecting integrated circuit dies to a printed wiring board | 47 | 1990 | |
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| 4,675,599 Testsite system | 14 | 1985 | |
| 4,739,257 Testsite system | 56 | 1986 | |
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| 5,008,614 TAB frame and process of testing same | 38 | 1988 | |
| 4,987,365 Method and apparatus for testing integrated circuits | 22 | 1989 | |
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| 4,956,605 Tab mounted chip burn-in apparatus | 25 | 1989 | |
| 4,932,883 Elastomeric connectors for electronic packaging and testing | 64 | 1989 | |
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| 4,843,313 Integrated circuit package carrier and test device | 47 | 1984 | |
| 4,783,719 Test connector for electrical devices | 104 | 1987 | |
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| 4,970,460 Controlled impedance testsite | 19 | 1987 | |
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| 4,725,918 Protective insert for chip carriers | 19 | 1986 | |
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| 4,683,423 Leadless chip test socket | 17 | 1985 | |
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| 4,686,468 Contact set for test apparatus for testing integrated circuit package | 21 | 1984 | |
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| 4,288,841 Double cavity semiconductor chip carrier | 243 | 1979 | |
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| 5,008,617 Functional testing of ultra large area, ultra large scale integrated circuits | 36 | 1989 | |
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| 4,859,614 Method for manufacturing semiconductor device with leads adhered to supporting insulator sheet | 25 | 1987 | |
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| 4,954,878 Method of packaging and powering integrated circuit chips and the chip assembly formed thereby | 138 | 1989 | |
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| 4,996,476 Test clip for surface mount device | 44 | 1989 | |
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| 4,437,718 Non-hermetically sealed stackable chip carrier package | 51 | 1981 | |
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| 4,801,561 Method for making a pre-testable semiconductor die package | 59 | 1987 | |
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| 4,766,371 Test board for semiconductor packages | 78 | 1986 | |
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| 4,554,505 Test socket for a leadless chip carrier | 59 | 1983 | |
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| 5,173,451 Soft bond for semiconductor dies | 41 | 1992 | |
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| 5,023,189 Method of thermal balancing RF power transistor array | 17 | 1990 | |
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| 4,683,425 Integrated circuit test clip | 7 | 1985 | |
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| 4,324,040 Tool for removing integrated circuits from a burn-in board | 14 | 1980 | |
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| 4,597,617 Pressure interconnect package for integrated circuits | 114 | 1984 | |
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| 5,002,895 Wire bonding method with a frame, for connecting an electronic component for testing and mounting | 32 | 1989 | |
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| 4,340,860 Integrated circuit carrier package test probe | 67 | 1980 | |
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| 4,779,047 Burn-in apparatus for integrated circuits mounted on a carrier tape | 20 | 1987 | |